Apple plans to adopt TSMC’s advanced SoIC (System on Integrated Chip) packaging technology for its upcoming M5 chips. This strategy aims to enhance the performance of consumer Macs, as well as AI servers and tools that rely on cloud computing.
TSMC’s SoIC technology, introduced in 2018, allows chips to be stacked in three dimensions, improving electrical performance and thermal management compared to traditional designs.
According to the Economic Daily, Apple is collaborating with TSMC on a next-generation hybrid SoIC package that incorporates thermoplastic carbon fiber composite molding technology. This new package is currently in small trial production, with mass production planned for 2025 and 2026 to support new Macs and AI cloud servers.
References to Apple’s M5 chip have seemingly been found in official Apple code. The Cupertino firm is reportedly working on processors for its AI servers using TSMC’s 3nm process, with mass production aimed for the second half of 2025. However, Haitong analyst Jeff Pu has indicated that Apple’s plans for late 2025 are to use its M4 chip for AI servers.
Currently, Apple’s AI cloud servers are believed to utilize multiple M2 Ultra chips, originally designed for desktop Macs.
The future adoption of the M5 chip, with its dual-use design, signifies Apple’s move to vertically integrate its supply chain for AI capabilities across computers, cloud servers, and software.
