Apple’s forthcoming plans for iPhone upgrades have been well documented, with reports claiming that three new devices will be out later in the fall. Now, Macotakara has brought out a detailed, hands-on look at the schematics of these upcoming devices.
Macotakara’s blog states that these ‘final design’ schematics have been floating around the Asian supply chain for the last week, allowing for the creation of 3D mockups.
The 5.8 inch iPhone X that’s said to be coming this year has dimensions of 143.65 mm by 72.03 mm by 7.69 mm thick. This means that this years model will be 1.1mm wider than it has been noted that this could be because of a simple discrepancy caused by button height. A current iPhone X case was also successfully used on the 3D mockup.
The schematics of the 6.4 inch OLED iPhone indicate dimensions of 157.53mm by 77.44 mm by 7.85 mm thick. This can therefore be comparable to the iPhone 8 Plus which is only about 1mm shorter and 1mm wider.
In regards to thickness, the 6.4 inch iPhone X Plus is roughly .35mm thicker meaning that cases for the iPhone 8 Plus are unlikely to fit. It’s also likely that this device will feature the same camera technology as the current iPhone X, with a TrueDepth sensor measuring the same dimensions.
Finally, the 6.0 inch LCD iPhone measures 150.91 by 75.72 mm by 8.47 mm thick placing it right between the iPhone X and the iPhone 8 Plus.
The video below shows a comparison between the 2018 dummy units and the iPhone X, iPhone 7, and iPhone 8 Plus.
