TSMC has a long-standing reputation as the world’s largest and most valuable semiconductor company. The partnership between TSMC and the tech giant kicked off in 2014 with the manufacturing of A-series SoCs (system-on-a-chip) for various products, including iPhones, iPads, iPod Touch, and Apple TV.
Over time, this collaboration grew to encompass S-series chips for Apple Watch, H-series chips for AirPods, the latest M-series chips for Macs, W-series chips for Bluetooth and Wi-Fi connectivity, and U-series, Ultrawide Band chips for spatial awareness.
The so-called “sweetheart deal” between the two companies allowed for the development of the state-of-the-art A17 chip. Given that Apple was its largest customer, it was only natural that TSMC would sign a special agreement with the Cupertino-based tech behemoth. The agreement entails exclusive production of 3nm chips for the first years of the technology’s debut, and more significantly, TSMC’s commitment to bear the cost of any defects in A17 production.
The courage to undertake such a responsibility might stem from the tech giant’s recent revelation of having an active installed base of 1.8 billion devices. Furthermore, the report indicates that the M3 chip for future Macs will also be built on the 3nm process.
In 2020, there were already whispers that TSMC would commence mass production of 3nm chips in 2022 specifically for these devices. By leveraging the FinFET fin field-effect transistors, TSMC’s 3nm technology promises a remarkable improvement in both performance and power efficiency compared to the currently used 5nm chips.
The stage is set for an exciting September event, slated for the 12th, where the new iPhone 15, iPhone 15 Pro, Apple Watch Series 9, Apple Watch Ultra (second generation), iPad mini 7, and other devices are expected to be unveiled.